There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update kernel-doc comment and documentation for cpufreq_thermal_notifier.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add documentation for cpufreq_get_cooling_level. As this
is an exported function, it has to be documented.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As this is one of the central functions of this file,
it deserves a proper documentation. This patch improves
the existing comment to format it as a kernel-doc style.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update documentation for is_cpufreq_valid function so
that kernel-doc does not complain about return value.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
level will be used only if GET_FREQ mode is requested.
There is no potential harm with current code. But for
cleaning the compilation log, this patch initializes
level to zero.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Restrict the usage to GPL modules.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simple fixes for making kernel_doc happy about
struct cpufreq_cooling_device. Includes also a minor
spelling fix.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This code doesn't work on big endian systems because we're storing low
values in the high bits of the unsigned long. It makes it a very high
value instead.
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.
It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.
Build them into one module in this patch.
This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.
No functional change in this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
In multiplatform configurations, we cannot include headers
provided by only the exynos platform. Fortunately a number
of drivers that include those headers do not actually need
them, so we can just remove the inclusions.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
When selecting a target cooling state in get_target_state(), make sure
that the state is at least as high as the minimum when the temperature
is rising and at least as low as the maximum when the temperature is
falling. This is necessary because, in the THREAML_TREND_RAISING and
THERMAL_TREND_DROPPING cases, the current state may only be incremented
or decremented by one even if it is outside the bounds of the thermal
instance. This might occur, for example, if the CPU is heating up
and hits a thermal trip point for the first time when it's frequency
is much higher than the range specified by the thermal instance
corresponding to the trip point.
Signed-off-by: Andrew Bresticker <abrestic@chromium.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.
In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Current rcar_thermal() didn't care about own power.
Without this patch, rcar_thermal doesn't work on APE6 board
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Current rcar_thermal driver didn't care about rcar_theraml_irq_disable()
when registration failure case on _probe(), and _remove().
And, it returns without unregistering thermal zone when
registration failure case on _probe().
This patch fixes these issue.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.
Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.
The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.
Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The currently formula has been taken from the 88AP510 SoC datasheet,
which is not exactly correct. The correct value for the temperature
in Celcius of the sensor present in this SoC is:
Celsius = (322-reg)/1.3625
Signed-off-by: Lior Amsalem <alior@marvell.com>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Acked-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The currently formula has been taken from the 88AP510 SoC datasheet,
which is not exactly correct. The correct value for the temperature
in Celcius of the sensor present in this SoC is:
Celsius = (322-reg)/1.3625
Signed-off-by: Lior Amsalem <alior@marvell.com>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Acked-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The correct value is obtain by first shifting the register by the offset,
later applying the valid mask and finally invert the result.
This check was lacking an extra parenthesis to be strictly correct.
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
thermal_zone_device_register() returns ERR_PTR on error, thus use
IS_ERR rather than IS_ERR_OR_NULL to check return value.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
cpufreq cooling uses different frequencies as different cooling states.
But the per_cpu cpufreq_frequency_table may contain duplicate,
invalid entries, and it may be in either ascending or descending order.
And currently, code for parsing the per_cpu cpufreq_frequency_table
is used in several places and inconsistent.
Now introduce new code to
1. get the maximum cooling states
2. translate cooling state to cpu frequency
3. translate cpu frequency to cooling state
in one place,
with the correct logic of handling per_cpu cpufreq_frequency_table.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
we are returning EINVAL while the thermal_zone_device_register function fail.
instead we can use the return value from the thermal_zone_device_register by
using PTR_ERR.
Signed-off-by: Devendra Naga <devendra.aaru@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
thermal_zone_device_register returns a value contained in the pointer itself
use PTR_ERR to obtain the address and return it at the end.
Signed-off-by: Devendra Naga <devendra.aaru@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Acked-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Andrew Lunn <andrew@lunn.ch>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add the missing unlock before return from function rcar_thermal_update_temp()
in the error handling case.
Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The new intel_powerclamp thermal cooling device driver was merged in
commit 2af78448ff (Pull thermal management updates from Zhang Rui)
without any data conflicts. But there was a more subtle conflict I
missed: the driver uses MAX_USER_RT_PRIO, but commit 8bd75c77b7
("sched/rt: Move rt specific bits into new header file") had moved that
define from <linux/sched.h> to <linux/sched/rt.h>.
Which caused this build failure:
drivers/thermal/intel_powerclamp.c: In function ‘clamp_thread’:
drivers/thermal/intel_powerclamp.c:360:21: error: ‘MAX_USER_RT_PRIO’ undeclared (first use in this function)
drivers/thermal/intel_powerclamp.c:360:21: note: each undeclared identifier is reported only once for each function it appears in
And because I don't do a full "make allmodconfig" build after each pull,
I didn't notice until too late. So now the fix is here, separately from
the merge commit.
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
Pull thermal management updates from Zhang Rui:
"Highlights:
- introduction of Dove thermal sensor driver.
- introduction of Kirkwood thermal sensor driver.
- introduction of intel_powerclamp thermal cooling device driver.
- add interrupt and DT support for rcar thermal driver.
- add thermal emulation support which allows platform thermal driver
to do software/hardware emulation for thermal issues."
* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
thermal: rcar: remove __devinitconst
thermal: return an error on failure to register thermal class
Thermal: rename thermal governor Kconfig option to avoid generic naming
thermal: exynos: Use the new thermal trend type for quick cooling action.
Thermal: exynos: Add support for temperature falling interrupt.
Thermal: Dove: Add Themal sensor support for Dove.
thermal: Add support for the thermal sensor on Kirkwood SoCs
thermal: rcar: add Device Tree support
thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
thermal: rcar: add interrupt support
thermal: rcar: add read/write functions for common/priv data
thermal: rcar: multi channel support
thermal: rcar: use mutex lock instead of spin lock
thermal: rcar: enable CPCTL to use hardware TSC deciding
thermal: rcar: use parenthesis on macro
Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
Thermal: fix a wrong comment
thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
PM: intel_powerclamp: off by one in start_power_clamp()
thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
...
Convert to the much saner new idr interface.
Signed-off-by: Tejun Heo <tj@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
commit 76cc18874 "thermal: rcar: add Device Tree support"
added device tree support for this driver, but also added
an instance of __devinitconst, which is no longer defined
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Zhang Rui <rui.zhang@intel.com>
The return code from the registration of the thermal class is used to
unallocate resources, but this failure isn't passed back to the caller of
thermal_init. Return this failure back to the caller.
This bug was introduced in changeset 4cb18728 which overwrote the return code
when the variable was re-used to catch the return code of the registration of
the genetlink thermal socket family.
Signed-off-by: Richard Guy Briggs <rbriggs@redhat.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.
Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch uses the quick thermal cooling trend type macros. This is needed
as exynos5 and other thermal sensors now supports only interrupt method for
thresold temperature check.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
