Eduardo Valentin 57d1617137 thermal: ti-soc-thermal: use standard GPIO DT bindings ...

This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.

Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

2013-07-08 10:11:59 -04:00

..

dra752-bandgap.h

thermal: ti-soc-thermal: add thermal data for DRA752 chips

2013-06-13 10:15:52 +08:00

dra752-thermal-data.c

thermal: ti-soc-thermal: add thermal data for DRA752 chips

2013-06-13 10:15:52 +08:00

Kconfig

thermal: ti-soc-thermal: add thermal data for DRA752 chips

2013-06-13 10:15:52 +08:00

Makefile

thermal: ti-soc-thermal: add thermal data for DRA752 chips

2013-06-13 10:15:52 +08:00

omap4-thermal-data.c

…

omap4xxx-bandgap.h

…

omap5-thermal-data.c

…

omap5xxx-bandgap.h

…

ti-bandgap.c

thermal: ti-soc-thermal: use standard GPIO DT bindings

2013-07-08 10:11:59 -04:00

ti-bandgap.h

thermal: ti-soc-thermal: add dra752 chip to device table

2013-06-13 10:16:07 +08:00

ti-thermal-common.c

thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL

2013-06-13 10:14:00 +08:00

ti-thermal.h

thermal: ti-soc-thermal: add thermal data for DRA752 chips

2013-06-13 10:15:52 +08:00

TODO

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