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As thermal drivers can be built as modules and also the thermal framework itself, building cpu cooling only as built-in can cause linking errors. For instance: * Generic Thermal sysfs driver * Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y with the following drive: CONFIG_OMAP_BANDGAP=m generates: ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! This patch changes cpu cooling driver to allow it to be built as module. Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
126 lines
3.5 KiB
Plaintext
126 lines
3.5 KiB
Plaintext
#
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# Generic thermal sysfs drivers configuration
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#
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menuconfig THERMAL
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tristate "Generic Thermal sysfs driver"
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help
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Generic Thermal Sysfs driver offers a generic mechanism for
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thermal management. Usually it's made up of one or more thermal
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zone and cooling device.
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Each thermal zone contains its own temperature, trip points,
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cooling devices.
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All platforms with ACPI thermal support can use this driver.
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If you want this support, you should say Y or M here.
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if THERMAL
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config THERMAL_HWMON
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bool
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depends on HWMON=y || HWMON=THERMAL
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default y
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choice
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prompt "Default Thermal governor"
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default THERMAL_DEFAULT_GOV_STEP_WISE
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help
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This option sets which thermal governor shall be loaded at
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startup. If in doubt, select 'step_wise'.
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config THERMAL_DEFAULT_GOV_STEP_WISE
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bool "step_wise"
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select STEP_WISE
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help
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Use the step_wise governor as default. This throttles the
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devices one step at a time.
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config THERMAL_DEFAULT_GOV_FAIR_SHARE
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bool "fair_share"
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select FAIR_SHARE
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help
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Use the fair_share governor as default. This throttles the
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devices based on their 'contribution' to a zone. The
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contribution should be provided through platform data.
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config THERMAL_DEFAULT_GOV_USER_SPACE
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bool "user_space"
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select USER_SPACE
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help
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Select this if you want to let the user space manage the
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lpatform thermals.
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endchoice
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config FAIR_SHARE
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bool "Fair-share thermal governor"
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help
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Enable this to manage platform thermals using fair-share governor.
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config STEP_WISE
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bool "Step_wise thermal governor"
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help
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Enable this to manage platform thermals using a simple linear
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config USER_SPACE
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bool "User_space thermal governor"
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help
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Enable this to let the user space manage the platform thermals.
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config CPU_THERMAL
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tristate "generic cpu cooling support"
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depends on CPU_FREQ
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select CPU_FREQ_TABLE
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help
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This implements the generic cpu cooling mechanism through frequency
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reduction, cpu hotplug and any other ways of reducing temperature. An
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ACPI version of this already exists(drivers/acpi/processor_thermal.c).
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This will be useful for platforms using the generic thermal interface
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and not the ACPI interface.
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If you want this support, you should say Y here.
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config SPEAR_THERMAL
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bool "SPEAr thermal sensor driver"
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depends on PLAT_SPEAR
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depends on OF
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help
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Enable this to plug the SPEAr thermal sensor driver into the Linux
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thermal framework
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config RCAR_THERMAL
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tristate "Renesas R-Car thermal driver"
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depends on ARCH_SHMOBILE
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help
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Enable this to plug the R-Car thermal sensor driver into the Linux
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thermal framework
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config EXYNOS_THERMAL
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tristate "Temperature sensor on Samsung EXYNOS"
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depends on (ARCH_EXYNOS4 || ARCH_EXYNOS5)
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depends on CPU_THERMAL
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help
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If you say yes here you get support for TMU (Thermal Managment
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Unit) on SAMSUNG EXYNOS series of SoC.
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config DB8500_THERMAL
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bool "DB8500 thermal management"
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depends on ARCH_U8500
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default y
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help
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Adds DB8500 thermal management implementation according to the thermal
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management framework. A thermal zone with several trip points will be
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created. Cooling devices can be bound to the trip points to cool this
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thermal zone if trip points reached.
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config DB8500_CPUFREQ_COOLING
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tristate "DB8500 cpufreq cooling"
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depends on ARCH_U8500
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depends on CPU_THERMAL
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default y
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help
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Adds DB8500 cpufreq cooling devices, and these cooling devices can be
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bound to thermal zone trip points. When a trip point reached, the
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bound cpufreq cooling device turns active to set CPU frequency low to
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cool down the CPU.
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endif
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