Zhang Rui b81b6ba3d9 Thermal: rename structure thermal_cooling_device_instance to thermal_instance ...

This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.

thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

2012-09-24 14:44:37 +08:00

..

Kconfig

drivers/thermal/spear_thermal.c: add Device Tree probing capability

2012-06-02 01:49:38 -04:00

Makefile

thermal: add support for thermal sensor present on SPEAr13xx machines

2012-03-22 01:05:32 -04:00

spear_thermal.c

Thermal: Remove tc1/tc2 in generic thermal layer.

2012-09-24 14:44:36 +08:00

thermal_sys.c

Thermal: rename structure thermal_cooling_device_instance to thermal_instance

2012-09-24 14:44:37 +08:00