 zhang
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354606fd89
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fix:add the publishAs field in bundle.json
Signed-off-by: zhang <zhangfengxi@huawei.com>
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2022-08-30 16:29:50 +08:00 |
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shijie
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f92c609cb2
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feat: add thermal dfx function
Signed-off-by: shijie <shijie20@huawei.com>
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2022-07-04 11:02:17 +08:00 |
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toutes
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a64c6bcedf
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build: Modify the component name
Signed-off-by: toutes <zhaoruiyuan2@huawei.com>
Change-Id: I16b7ad89b7883eb207fa03ca7511ef143ab6cf40
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2022-06-21 20:20:00 -07:00 |
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yuanbo
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e283a03a2f
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feat: normalize drivers framework component and repos
Signed-off-by: yuanbo <yuanbo@huawei.com>
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2022-06-16 14:48:04 +08:00 |
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aqxyjay
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2c3a359a4c
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refactor: remove redunduant innerkits and decouple with thermal service
Signed-off-by: aqxyjay <zhangchunxin@huawei.com>
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2022-05-20 09:04:31 +08:00 |
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openharmony_ci
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a02e9518a4
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!692 fix: update rom/ram information of hdf components
Merge pull request !692 from Zhang/master
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2022-02-19 10:41:30 +00:00 |
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zhang
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1e7681efe8
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fix: update rom/ram information of hdf components
Signed-off-by: zhang <zhangfengxi@huawei.com>
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2022-02-18 16:38:03 +08:00 |
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q00569459
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0a26ea4db9
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Modify temp report logic
Signed-off-by: q00569459 <qinchang2@huawei.com>
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2022-02-18 13:24:03 +08:00 |
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wangyipeng
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10d0ff7146
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Fix:HDI prefix modify
Signed-off-by: wangyipeng <wangyipeng11@huawei.com>
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2022-02-16 14:24:14 +08:00 |
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zhang
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1366e22cad
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feat：add hdf component
Signed-off-by: zhang <zhangfengxi@huawei.com>
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2022-01-21 21:31:00 +08:00 |
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q00569459
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b6cda86d13
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Upload thermal hdf
Signed-off-by: q00569459 <qinchang2@huawei.com>
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2022-01-17 18:58:31 +08:00 |
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q00569459
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fef8b1293e
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Upload thermal hdf
Signed-off-by: q00569459 <qinchang2@huawei.com>
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2022-01-17 11:52:57 +08:00 |
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