h30013885 2fef103492 modify ipc build ...

Signed-off-by: h30013885 <heyinshen1@huawei.com>

2024-06-18 17:38:43 +08:00

..

cred_manager

optimize string_util

2024-03-15 11:02:05 +08:00

creds_manager

fix ImportCredential failed issue

2023-12-16 16:44:58 +08:00

data_manager

adapt upgrade data

2024-06-18 11:55:03 +08:00

frameworks

adapt upgrade data

2024-06-18 11:55:03 +08:00

identity_manager

adapt upgrade data

2024-06-18 11:55:03 +08:00

key_agree_sdk

optimize string_util

2024-03-15 11:02:05 +08:00

legacy

adapt upgrade data

2024-06-18 11:55:03 +08:00

mk_agree

!493 change memory interface in mini system

2023-08-06 14:44:33 +00:00

privacy_enhancement

modify os account adapter

2023-11-06 15:07:39 +08:00

protocol

Log optimization

2024-01-15 21:41:42 +08:00

session_manager

adapt upgrade data

2024-06-18 11:55:03 +08:00

BUILD.gn

modify ipc build

2024-06-18 17:38:43 +08:00

device_auth.c

add fuzz code

2024-05-04 12:10:23 +08:00

device_auth.map

支持应用级绑定

2023-12-01 17:48:37 +08:00

deviceauth_account.gni

支持应用级绑定

2023-12-01 17:48:37 +08:00

deviceauth.gni

optimize string_util

2024-03-15 11:02:05 +08:00