新增bundle.json文件

Signed-off-by: deveco_xdevice <liguangjie1@huawei.com>
This commit is contained in:
deveco_xdevice 2024-02-05 17:07:58 +08:00
parent 74bc2a6a78
commit 53b0fe86f9

29
bundle.json Normal file
View File

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{
"name": "@openharmony/xdevice",
"version": "2.30.0",
"description": "xdevice",
"license": "Apache License 2.0",
"publishAs": "code-segment",
"segment": {
"destPath": "test/testfwk/xdevice"
},
"scripts": {},
"repository": "",
"dirs": {},
"component": {
"name": "xdevice",
"subsystem": "testfwk",
"syscap": [],
"features" :[],
"adapted_system_type": [ "mini", "small", "standard" ],
"rom": "0KB",
"ram": "0KB",
"deps": {},
"build": {
"sub_component": [
],
"inner_kits": [],
"test": []
}
}
}