pete-lipeng 428b808db2 add ta guide
Signed-off-by: pete-lipeng <petersun.li@huawei.com>
2023-08-18 20:03:34 +08:00
2023-08-18 20:03:34 +08:00
2023-08-18 20:03:34 +08:00
2022-03-18 14:18:38 +08:00
2022-03-18 14:18:38 +08:00
2023-05-19 12:02:08 +08:00
2022-03-18 14:18:38 +08:00
2022-03-18 14:18:38 +08:00

tee_dev_kit module introduction

Introduction

The tee_dev_kit component provides SDK capabilities. The SDK capabilities include: TA compilation dependent scripts, header files, TA's ability to issue certificates and sign perm_config signatures, and sec file signatures.

tee_dev_kit engineering framework

  • README.mdEnglish guidance document.
  • README_zh.mdChinese guidance document.
  • sdkThe sdk package capabilities in tee os, the detailed sdk capabilities are introduced in the README.md and README_zh.md files in the sdk directory.
  • bundle.json: tee_dev_kit component description file.
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Readme MulanPSL-2.0 2.6 MiB
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