add bundle.json

Signed-off-by: pjscc <pangjiashuai@huawei.com>
This commit is contained in:
pjscc
2022-01-20 17:01:22 +08:00
parent cd88c126aa
commit 4cf6f9cfe1
+34
View File
@@ -0,0 +1,34 @@
{
"name": "@ohos/mtd_utils",
"description": "MTD subsystem (stands for Memory Technology Devices) provides an abstraction layer for raw flash devices. It makes it possible to use the same API when working with different flash types and technologies, e.g. NAND, OneNAND, NOR, AG-AND, ECC'd NOR, etc.",
"version": "3.1",
"license": "GPL V2.0",
"publishAs": "code-segment",
"segment": {
"destPath": "third_party/mtd-utils"
},
"dirs": {},
"scripts": {},
"licensePath": "COPYING",
"readmePath": {
"en": ""
},
"component": {
"name": "thirdparty_mtd_utils",
"subsystem": "",
"syscap": [],
"features": [],
"adapted_system_type": [],
"rom": "",
"ram": "",
"deps": {
"components": [],
"third_party": []
},
"build": {
"sub_component": [],
"inner_kits": [],
"test": []
}
}
}